N-(3-Triethoxysilylpropyl)ethylenediamine CAS No:5089-72-5 C11H28N2O3Si

N-(3-Triethoxysilylpropyl)ethylenediamine CAS No:5089-72-5 C11H28N2O3Si
N-(3-Triethoxysilylpropyl)ethylenediamine CAS No:5089-72-5 C11H28N2O3Si
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  • Product Name:N-(3-Triethoxysilylpropyl)ethylenediamine
  • CAS No.:5089-72-5
  • Molecular Formula:C11H28N2O3Si
  • Brand Name:Atomix
  • Description:
  • EINECS No.:225-806-1
  • Appearance:Colorless, transparent liquid
  • Purity :≥ 99.0%
  • Density:0.97
  • Refractive index:1.438
  • Boiling Point(°C):273
  • Flash Point(°C):123
  • Storage Conditions:2-8°C, protect from light
  • Package:200kg/Drum; 25kg/Drum; 1000kg IBC Drum
  • Sample: Available or Free sample
  • Certifications: COA,MSDS,TDS,ISO9001,C/O,Form A etc

N-(3-Triethoxysilylpropyl)ethylenediamine CAS No:5089-72-5 C11H28N2O3Si

Applications

1. When added to the formulations of adhesives and sealants, N-aminoethyl-3-aminopropyl triethoxysilane enhances their adhesion to inorganic substrates such as glass, metal, and ceramics. It is suitable for applications requiring high-strength bonding, such as in the construction and automotive manufacturing industries.

2. In coatings and paints, it acts as an adhesion promoter, improving the adhesion of the coating to various substrates, preventing peeling and blistering, extending the service life of the coating, and enhancing its water resistance and weather resistance. In the production of glass fiber composite materials, this substance is also used to treat the surface of glass fibers, strengthening their bond with the resin matrix and improving the mechanical properties and durability of the composite materials.

3. Furthermore, it can be used to modify inorganic fillers, such as wollastonite and talc, to improve their dispersion in organic polymers and enhance the performance of composite materials. In electronic encapsulation materials, it is used to improve the adhesion of encapsulation materials—such as epoxy resins—to chips and substrates, ensuring the reliability and durability of electronic components.

 


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