
Main Applications
1. Core Industrial Applications: As a latent curing agent for epoxy resins, with a recommended usage ratio of 7–8 parts, curing conditions: 150°C for 20–30 minutes. Compared to traditional dicyandiamide curing agents, it requires a lower curing temperature and shorter curing time. It is used in the preparation of powder coatings, adhesives, and encapsulation materials for electronic components, enhancing the coating film’s flexibility, water resistance, weather resistance, corrosion resistance, and insulation properties. It is widely used in decorative powders, insulating powders, heavy-duty anti-corrosion powders, oil pipelines, aerospace, and other fields.
2. Other Applications: It can be used as a modifier for polymer materials, an intermediate for pharmaceuticals and pesticides, and a laboratory chemical reagent.
Storage and Safety Precautions
Storage Conditions: Store in a dry, cool, and well-ventilated area. Strictly avoid direct sunlight and high-temperature environments. Keep away from sources of fire and heat, and store separately from strong oxidizing agents, strong acids, strong bases, and other such substances.
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