
Main Applications:
1. Coatings/Inks/Adhesives: UV coatings for metal or plastic substrates to enhance hardness, abrasion resistance, and chemical resistance; a key component in PCB solder mask green ink to improve resolution and solder resistance.
2. 3D Printing Resins: Serves as a core crosslinking agent in SLA/DLP/MSLA processes, imparting high tensile strength (75–82 MPa), high hardness (Rockwell R115+), and excellent dimensional stability; often blended with flexible monomers to balance brittleness.
3. Electronic Encapsulation and Structural Adhesives: High-strength UV adhesives for mobile phone casing assembly, semiconductor packaging fixtures, microfluidic chips, and other applications requiring high solvent resistance and low post-curing shrinkage.
4. Others: Some studies mention its use as a cosolvent in lithium-ion battery electrolytes (to suppress dendrite formation), but this is not a mainstream industrial application.
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